Samsung Electronics is ready to make history. The company will begin delivering its new high-bandwidth memory 4 (HBM4) chips to Nvidia during the third week of February. This move marks the first time any manufacturer has shipped a mass-produced version of these advanced AI chips to a customer.
Industry insiders confirmed on Sunday that Samsung plans to start the shipments right after the Lunar New Year holiday. Samsung recently finished a long testing phase with Nvidia to ensure the chips meet their strict standards. These chips will play a major role in powering Nvidia’s next generation of artificial intelligence tools, specifically the “Vera Rubin” platform.
Nvidia CEO Jensen Huang recently told audiences that the Vera Rubin chips are already in full production. Tech fans expect to see the platform in action during the GTC 2026 conference in mid-March. If everything goes according to plan, these powerful AI systems will hit the market in the second half of this year.
Samsung is using its most advanced manufacturing techniques to stay ahead of the pack. They built these chips using a combination of their sixth-generation 10-nanometer DRAM technology and a 4-nanometer logic process. This setup allows the chips to reach data speeds of 11.7 gigabits per second. To put that in perspective, that speed is significantly faster than the industry’s standard requirement of 8 gigabits per second.
However, the race is far from over. Samsung faces a massive challenge from its main rival, SK hynix. Both companies are fighting to be Nvidia’s top supplier. While Samsung is leading on speed and early delivery, SK hynix has a reputation for more stable production lines. This means SK hynix might be able to produce a higher volume of chips with fewer defects.
The coming months will be a major test for Samsung. To win this battle, the company must prove it can produce these complex chips in large numbers without losing quality. If they succeed, they will secure a dominant spot in the booming AI hardware market.
